• Audio
  • Live tv
  • About Us
  • Contact Us
  • Privacy Policy
  • Terms of Service
Monday, May 29, 2023
Morning News
No Result
View All Result
  • Login
  • Home
  • News
    • Local
    • National
    • World
  • Markets
  • Economy
  • Crypto
  • Real Estate
  • Sports
  • Entertainment
  • Health
  • Tech
    • Automotive
    • Business
    • Computer Sciences
    • Consumer & Gadgets
    • Electronics & Semiconductors
    • Energy & Green Tech
    • Engineering
    • Hi Tech & Innovation
    • Machine learning & AI
    • Security
    • Hardware
    • Internet
    • Robotics
    • Software
    • Telecom
  • Lifestyle
    • Fashion
    • Travel
    • Canadian immigration
  • App
    • audio
    • live tv
  • Home
  • News
    • Local
    • National
    • World
  • Markets
  • Economy
  • Crypto
  • Real Estate
  • Sports
  • Entertainment
  • Health
  • Tech
    • Automotive
    • Business
    • Computer Sciences
    • Consumer & Gadgets
    • Electronics & Semiconductors
    • Energy & Green Tech
    • Engineering
    • Hi Tech & Innovation
    • Machine learning & AI
    • Security
    • Hardware
    • Internet
    • Robotics
    • Software
    • Telecom
  • Lifestyle
    • Fashion
    • Travel
    • Canadian immigration
  • App
    • audio
    • live tv
No Result
View All Result
Morning News
No Result
View All Result
Home Tech Electronics & Semiconductors

Fast burst of infrared light opens a way for 3D processing inside semiconductor chips

author by author
November 8, 2022
in Electronics & Semiconductors, Hi Tech & Innovation
Reading Time: 4 mins read
0 0
A A
0
0
SHARES
14
VIEWS
Share on FacebookShare on TwitterLinkedinReddit

Set of 5 Clipper-mate Pocket Combs 5" All Fine Teeth

Avalon Coconut Body Lotion, 7 Ounce, Coconut, 7 ounces, 7 oz

Fast burst of infrared light opens a way for 3D processing inside semiconductor chips
When intense light from ultrafast lasers is focused inside a semiconductor, highly efficient nonlinear ionization along the beam path creates an opaque plasma that prevents reaching enough energy localization near focus for material writing. Researchers from French National Center for Scientific Research (CNRS, LP3 lab.) found a new solution to solve this important engineering problem. By splitting the energy of infrared ultrafast pulses to form ultrafast bursts of less intense pulses, better localization of excitation is demonstrated. Using fast enough bursts, they accumulate enough energy to cross the material modification threshold and thus locally add new functionalities inside the semiconductor chips. Credit: By Andong Wang, Pol Sopeña and David Grojo

Researchers from LP3 Laboratory in France developed a light-based technique for local material processing anywhere in the three-dimensional space of semiconductor chips. The direct laser writing of new functionalities opens the possibility to exploit the sub-surface space for higher integration densities and extra functions.

Semiconductors remain the backbone material of the electronics integrated with modern devices such as cellphones, cars, robots and many other intelligent devices. Driven by the continuous need for miniaturized and powerful chips, the current semiconductor manufacturing technologies are facing increasing pressure.

The dominating manufacturing technology, lithography, has strong limitations when addressing these challenges, given its surface processing nature. For this reason, a solution to fabricating structures under the wafer surfaces would be highly desirable so that the full space inside the materials could be exploited.

Publishing their report in the International Journal of Extreme Manufacturing, the LP3 researchers demonstrate the fabrication of embedded structures inside various semiconductor materials, including Si and GaAs—two important materials for the microelectronics industry which cannot be 3D processed with conventional ultrafast lasers.

The first requirement is the right choice of wavelength so that the light can penetrate the semiconductor material. In this research, the wavelength used is in the infrared, very similar to that used for telecommunication applications, so that the semiconductors are a fully transparent material.

Framed by the European Horizon project “Extreme-Light Seeded Control of Ultrafast Laser Material Modifications,” the team have made continuous efforts to extend the current spectrum of laser processing to a wider range from UV to infrared and even longer wavelengths. In this research, the standard telecommunication or so-called SWIR wavelengths were rapidly identified as excellent candidates for 3D processing inside semiconductors.

Although the technical issue of the appropriate wavelength was solved, there are some other physical limitations to tackle. With the use of intense light, as required for material processing, highly efficient nonlinear ionization inside narrow gap materials creates free electrons inside the material. This will rapidly transform any semiconductor into metal-like materials, which makes it impossible to propagate light deep inside the matter. This transition deteriorates the focusing process and prevents the occurrence of material modification using ultrafast lasers.

To solve this problem, the team proposed using non-conventional ultrafast bursts of pulses to circumvent the metallization transition. Explaining this, Dr. Andong Wang, one of the main investigators of this paper, says, “Previous research used too strong light pulses that were exciting the electrons too easily. Here, instead of using strong light pulses, we split the pulse energy into a large number of weaker pulses with an extremely fast repetition rate. These pulse trains, also named bursts, will avoid strong pulse excitation before the light is focused. Additionally, the pulses will repeat very fast so that the delivered laser energy can accumulate efficiently to cross the modification.”

The team leader behind this work, Dr. David Grojo, says, “This offers the first very practical solution for ultrafast laser writing inside semiconductors. The next step will be to concentrate on the type of modifications that can be achieved inside these materials. Refractive index engineering is surely an important target given the growing importance of silicon photonics. Laser writing would offer the possibility of direct digital fabrication of 3D architecture materials inaccessible by current manufacturing technologies. In the future, these new laser modalities may drastically change the way advanced micro-chips are today fabricated.”

More information:
Andong Wang, Pol Sopeña and David Grojo, Burst mode enabled ultrafast laser inscription inside gallium arsenide, International Journal of Extreme Manufacturing (2022). DOI: 10.1088/2631-7990/ac8fc3

Provided by
International Journal of Extreme Manufacturing

Citation:
Fast burst of infrared light opens a way for 3D processing inside semiconductor chips (2022, November 8)
retrieved 8 November 2022
from https://techxplore.com/news/2022-11-fast-infrared-3d-semiconductor-chips.html
This document is subject to copyright. Apart from any fair dealing for the purpose of private study or research, no
part may be reproduced without the written permission. The content is provided for information purposes only.
Tags: laserlonger wavelengthspulsesemiconductor
Previous Post

University of Waterloo brings back masking requirement in indoor instructional areas

Next Post

Parliamentary budget officer says climate change already costing economy billions

Related Posts

Electronics & Semiconductors

Phosphorus sets the pace in high-performance transistors

May 28, 2023
11
Energy & Green Tech

Crab shells could help power the next generation of rechargeable batteries

May 27, 2023
12
Next Post
N.L. storm

Parliamentary budget officer says climate change already costing economy billions

Leave a Reply Cancel reply

Your email address will not be published. Required fields are marked *

POPULAR TODAY

Canadian immigration

Canadian work experience requirement removed for engineers in Ontario

by author
May 28, 2023
0
12

Canadian work experience requirement removed for engineers in OntarioOn May 23 in Toronto, Monte McNaughton, the Ontario Minister of Labour,...

Suspect charged after elderly man stabbed and robbed in Markham

May 28, 2023
12

Ukraine president visits front-line areas as new phase nears

May 28, 2023
12
Revolut taps Koinly for automated cryptocurrency tax reports

Revolut taps Koinly for automated cryptocurrency tax reports

May 28, 2023
12
Robinhood launches fiat-to-crypto on-ramp for self-custody wallets and DApps

Robinhood launches fiat-to-crypto on-ramp for self-custody wallets and DApps

May 28, 2023
12

POPULAR NEWS

Dutch government to restrict sales of processor chip tech

May 15, 2023
33
Several travel industry groups said that a travel advisory for Florida issued by the NAACP could harm small businesses in the state, specifically Black-owned ones.

Travel groups say NAACP’s Florida advisory misses the mark

May 23, 2023
22
Here’s what happens to NFTs when you die: Nifty Newsletter, April 12–18

Here’s what happens to NFTs when you die: Nifty Newsletter, April 12–18

May 19, 2023
31
Paul Edmonds (center) with two healthcare providers from City of Hope.

How a Breakthrough Treatment Helped ‘Cure’ This Man of HIV

May 23, 2023
18

‘We are not cutting off trade’: Biden adviser says U.S. seeks to manage competition with China

May 27, 2023
15

EDITOR'S PICK

National

Almost two-thirds of products in these 4 key grocery store departments come in plastic packaging: report

by author
May 11, 2023
0
12

A new report suggests that almost two-thirds of products across four key departments in Canada’s grocery stores are packaged in...

Read more

French protests push for withdrawal of Macron’s pension plan

Canada’s premiers, police chiefs reup calls on Ottawa to reform bail

Institute develops device to test friction, wear associated with EV fluids

Why the stock market is so frustrating right now

Morning News

Welcome to our Ads

Create ads focused on the objectives most important to your business Please contact us info@morns.ca

PBMIY 3 in 1 15W Foldable Fast Wireless Charger Stand Compatible with iPhone 13/12/11Pro/Max/XR/XS Max/X

Modern Nightstand Bedside Desk Lamp Set of 2 for Bedroom, Living Room,Office, Dorm, Gold

Backup Camera for Car HD 1080P 4.3 Inch Monitor Rear View System Reverse Cam Kit Truck SUV Minivan Easy Installation

OPI Natural Nail Base Coat, Nail Polish Base Coat, 0.5 fl oz

  • Home
  • Audio
  • Live tv
  • About Us
  • Contact Us
  • Privacy Policy
  • Terms of Service

© 2022 Morning News - morns.ca by morns.ca.

No Result
View All Result
  • Home
  • News
    • Local
    • National
    • World
  • Markets
  • Economy
  • Crypto
  • Real Estate
  • Sports
  • Entertainment
  • Health
  • Tech
    • Automotive
    • Business
    • Computer Sciences
    • Consumer & Gadgets
    • Electronics & Semiconductors
    • Energy & Green Tech
    • Engineering
    • Hi Tech & Innovation
    • Machine learning & AI
    • Security
    • Hardware
    • Internet
    • Robotics
    • Software
    • Telecom
  • Lifestyle
    • Fashion
    • Travel
    • Canadian immigration
  • App
    • audio
    • live tv
  • Login

© 2022 Morning News - morns.ca by morns.ca.

Welcome Back!

Sign In with Facebook
Sign In with Google
Sign In with Linked In
OR

Login to your account below

Forgotten Password?

Retrieve your password

Please enter your username or email address to reset your password.

Log In
Go to mobile version